Si Chen

Protrusion of electroplated copper filled in through silicon vias during annealing process

Si Chen, Fei Qin, Tong An et al. · Microelectronics Reliability · 2016 · 34 citations

Engineering, Materials Engineering, Materials Science +12

A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

Si Chen, Lili Zhang, Johan Liu et al. · MATERIALS TRANSACTIONS · 2010 · 30 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface

Si Chen, Zhizhe Wang, Yunfei En et al. · Microelectronics Reliability · 2018 · 24 citations

Engineering, Materials Engineering, Materials Science +15

Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes

Min Zhang, Fei Qin, Si Chen et al. · Journal of Electronic Materials · 2022 · 22 citations

Engineering, Materials Engineering, Materials Science +11

Stress evolution mechanism and thermo-mechanical reliability analysis of copper-filled TSV interposer

Chen Yuan, Wei Su, Hong‐Zhong Huang et al. · Eksploatacja i Niezawodnosc - Maintenance and Reliability · 2020 · 21 citations · Full text

Engineering, Electrical Engineering, Materials Science +17