Concepedia

A.C. Tan

AT

6

Publications

105

Citations

6

H-Index

1993

Active since

Affiliations

Micron (Singapore)(Current)

Nanyang Technological University

A.C. Tan is an author at Micron (Singapore) specializing in engineering, materials science, and materials engineering.

Top concepts

EngineeringMaterial ScienceMaterials EngineeringElectronic Packaging3D PrintingSoft MatterApplied PhysicsMicrofabricationMechanical EngineeringRheology

Publications per year

1993–2009

6

Publications

6

Interfacial microstructures and kinetics of Au/SnAgCu

Teck Kheng Lee, Sam Zhang, Christian Wong et al. · Thin Solid Films · 2005 · 34 citations

Materials Science, Materials Engineering, Engineering +7

Tin and solder plating in the semiconductor industry : a technical guide

A.C. Tan · Medical Entomology and Zoology · 1993 · 17 citations

Engineering, Chemical Engineering, Surface Preparation +17

A Novel Joint-in-Via Flip-Chip Chip-Scale Package

T.K. Lee, Sam Zhang, Christian Wong et al. · IEEE Transactions on Advanced Packaging · 2006 · 15 citations

Materials Science, Pad Pitch, 3D Ic Architecture +14

Dissolution and reaction between Au and molten eutectic PbSn solder

Teck Kheng Lee, Sam Zhang, Christian Wong et al. · Materials Science and Engineering A · 2006 · 14 citations

Materials Engineering, Materials Science, Engineering +2

Assessment of Fluxless Solid Liquid Interdiffusion Bonding by Compressive Force of Au-PbSn and Au-SAC for Flip Chip Packaging

Teck Kheng Lee, Sam Zhang, Chee Cheong Wong et al. · IEEE Transactions on Advanced Packaging · 2009 · 13 citations

Materials Engineering, Materials Science, Chip-scale Package +15

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