2
Publications
27
Citations
2
H-Index
2006
Active since
Affiliations
T.K. Lee is an author at Micron (Singapore) specializing in microelectronics, engineering, and electronic packaging.
Top concepts
EngineeringMaterial ScienceMicroelectronicsElectronic Packaging3D PrintingSelf-assemblyApplied PhysicsSurface ScienceMicrofabricationComputer Engineering
Publications per year
2006–2006
2
2
A Novel Joint-in-Via Flip-Chip Chip-Scale Package
T.K. Lee, Sam Zhang, Christian Wong et al. · IEEE Transactions on Advanced Packaging · 2006 · 15 citations
Bonding Development for Non-Conductive Paste (NCP)
T.K. Lee, Edwin F. Lua, Kathy Low et al. · 2006 · 12 citations
Materials Science, Materials Engineering, Gold Stud Bumps +15
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