Benson Lin

A Novel System in Package with Fan-Out WLP for High Speed SERDES Application

Nan-Cheng Chen, Tung-Hsien Hsieh, Jimmy Jinn et al. · 2016 · 60 citations

Engineering, Computer Engineering, Electrical Engineering +17

Effect of oxidation on electromigration in 2-µm Cu redistribution lines capped with polyimide

I-Hsin Tseng, Po-Ning Hsu, Wei-You Hsu et al. · Results in Physics · 2021 · 28 citations · Full text

Natural Sciences, Electrical Engineering, Materials Science +11

Novel RDL Design of Wafer-Level Packaging for Signal/Power Integrity in LPDDR4 Application

Kai-Bin Wu, Tsung-Yi Kuo, Cheng-Chou Hung et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 24 citations

Engineering, Electrical Engineering, Low-power Design +16

A unique failure mechanism induced by chip to board interaction on fan-out wafer level package

C.K. Yu, W.S. Chiang, N. W. Liu et al. · 2017 · 20 citations

Engineering, Materials Engineering, Mechanical Behavior Of Materials +16

High Electromigration Lifetimes of Nanotwinned Cu Redistribution Lines

I-Hsin Tseng, Yujin Li, Benson Lin et al. · 2019 · 18 citations

Engineering, Electrical Engineering, Materials Science +12