Statistics
Publications
18
Citations
469
H-Index
12
Active since
2005
K.-D. Lang is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, packaging design, and manufacturing engineering.
Publications per year
2005–2017
18
18
Large area compression molding for Fan-out Panel Level Packing
Tanja Braun, S. Raatz, S. Voges et al. · 2015 · 77 citations
Engineering, Manufacturing Engineering, Manufacturing Processes +11
Sea water magnesium fuel cell power supply
Robert Hahn, Jan Mainert, Fabian Glaw et al. · Journal of Power Sources · 2015 · 56 citations
From wafer level to panel level mold embedding
Tanja Braun, K.-F. Becker, S. Voges et al. · 2013 · 44 citations
Engineering, Manufacturing Engineering, Materials Science +14
Through mold vias for stacking of mold embedded packages
Tanja Braun, K.-F. Becker, S. Voges et al. · 2011 · 40 citations
Engineering, Manufacturing Engineering, Materials Engineering +16
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