Hong Yu Li

Heterogeneous 2.5D integration on through silicon interposer

Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka et al. · Applied Physics Reviews · 2015 · 163 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Wafer-to-Wafer Hybrid Bonding Development by Advanced Finite Element Modeling for 3-D IC Packages

Lin Ji, Fa Xing, Hong Ji et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 63 citations

Engineering, Materials Science, Electronic Materials +16

Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Xiaowu Zhang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 55 citations

Engineering, Electrical Engineering, Electronic Materials +16

U50,488H Inhibits Effects of Norepinephrine in Rat Cardiomyocytes—Cross-Talk between κ-opioid and β-adrenergic Receptors

Xiao Yu, Hong Yu Li, Hong Xin Wang et al. · Journal of Molecular and Cellular Cardiology · 1998 · 46 citations

Medicine, Cardiology, Pharmacology +13

Advanced 3D Integration Technologies in Various Quantum Computing Devices

Peng Zhao, Yu Dian Lim, Hong Yu Li et al. · IEEE Open Journal of Nanotechnology · 2021 · 41 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17