Bruce St. Lawrence

Effect of microstructure on retained austenite stability and work hardening of TRIP steels

J. Chiang, Bruce St. Lawrence, J. D. Boyd et al. · Materials Science and Engineering A · 2011 · 299 citations

Materials Science, Engineering, Trip Steels +8

CVD Co and its application to Cu damascene interconnections

T. Nogami, J. Maniscalco, Anita Madan et al. · 2010 · 43 citations

Materials Science, Materials Engineering, Cvd Co +15

Novel Enhanced Stressor with Graded Embedded SiGe Source/Drain for High Performance CMOS Devices

M. Ieong, J. Sudijono, J.-H. Ku et al. · 2006 · 25 citations

Electrical Engineering, Semiconductor Device, Engineering +13

Carbon diffusion in supersaturated ferrite: a comparison of mean-field and atomistic predictions

Bruce St. Lawrence, Chad W. Sinclair, Michel Perez · Modelling and Simulation in Materials Science and Engineering · 2014 · 22 citations

Engineering, Material Simulation, Mean-field Elastic Prediction +18

High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility

T. Nogami, T. Bolom, A. Simon et al. · 2010 · 17 citations

Engineering, Nm Beol, Interconnect (Integrated Circuits) +16