Mihai Lazar

State of the art of high temperature power electronics

Cyril Buttay, Dominique Planson, Bruno Allard et al. · Materials Science and Engineering B · 2010 · 403 citations

Engineering, Electrical Engineering, Materials Science +12

Die Attach of Power Devices Using Silver Sintering – Bonding Process Optimisation and Characterization

Cyril Buttay, Amandine Masson, Jianfeng Li et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2011 · 67 citations

Engineering, Materials Engineering, Materials Science +13

A Study on the Temperature of Ohmic Contact to p-Type SiC Based on Ti₃SiC₂Phase

Tony Abi-Tannous, Maher Soueidan, Gabriel Ferro et al. · IEEE Transactions on Electron Devices · 2016 · 38 citations · Full text

Engineering, Materials Engineering, Materials Science +16

Ni–Al ohmic contact to p-type 4H-SiC

Heu Vang, Mihai Lazar, Pierre Brosselard et al. · Superlattices and Microstructures · 2006 · 34 citations · Full text

Engineering, Materials Engineering, Materials Science +12

Optical beam induced current measurements: principles and applications to SiC device characterization

Christophe Raynaud, Duy‐Minh Nguyen, Nicolas Dheilly et al. · physica status solidi (a) · 2009 · 22 citations

Engineering, Materials Engineering, Materials Science +15