T. Otsuka

High-temperature silicon carbide and silicon on insulator based integrated power modules

Alexander B. Lostetter, Jared Hornberger, Brice McPherson et al. · 2009 · 46 citations

Engineering, Electrical Engineering, Electronic Materials +16

Novel developments towards increased SiC power device and module efficiency

Takashi Nakamura, Masatoshi Aketa, Yoshiaki Nakano et al. · 2012 · 25 citations

Engineering, Electrical Engineering, Materials Science +13

Large current SiC power devices for automobile applications

Takashi Nakamura, Masashi Sasagawa, Yoshiaki Nakano et al. · 2010 · 25 citations

Engineering, Electrical Engineering, Materials Science +17

Nine Point Bending Test Technique for Understanding of Sintered Silver Die Bonding Failure Mechanism

Keisuke Wakamoto, K Fuji, T. Otsuka et al. · Experimental Techniques · 2023 · 14 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

High Temperature (250 °C) Silicon Carbide Power Modules With Integrated Gate Drive Boards

B. Reese, Brice McPherson, Robert Shaw et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2010 · 12 citations

Engineering, Electrical Engineering, Materials Science +17