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High-temperature silicon carbide and silicon on insulator based integrated power modules
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2009
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Integrated Power ModuleElectrical EngineeringEngineeringThermal EngineeringGate DriverPower DeviceHigh-temperature Silicon CarbidePower PackageAdvanced Packaging (Semiconductors)Applied PhysicsPower IcPower Semiconductor DeviceHeat TransferPower ElectronicsMicroelectronicsElectronic PackagingElectrical InsulationIntegrated Power Modules
This paper presents the challenges and results of fabricating a high temperature silicon carbide based integrated power module. The gate driver for the module was integrated into the power package and is rated for an ambient temperature of 250degC. The power module was tested up to 300 V bus voltage, 160 A peak current, and 250degC junction temperature.