S. Y. Pai

Assembly challenges in developing 3D IC package with ultra high yield and high reliability

Raghunandan Chaware, Ganesh Hariharan, Jeff Lin et al. · 2015 · 27 citations

Engineering, Computer Architecture, Ultra High Yield +21

B10 finding and correlation to thermal neutron soft error rate sensitivity for SRAMs in the sub-micron technology

Shi-Jie Wen, S. Y. Pai, Richard Wong et al. · 2010 · 26 citations

Electrical Engineering, Engineering, Physics +14

A study of piezoelectric properties of PLZT ferroelectric ceramics

S. T. Liu, S. Y. Pai, J. Kyonka · Ferroelectrics · 1978 · 17 citations

Materials Science, Engineering, Systemic Variation +13

Assembly process qualification and reliability evaluations for heterogeneous 2.5D FPGA with HiCTE Ceramic

Ganesh Hariharan, Raghunandan Chaware, Laurene Yip et al. · 2013 · 15 citations

Engineering, Vlsi Design, Device Integration +22

Assembly process integration challenges and reliability assessment of multiple 28nm FPGAs assembled on a Large 65nm passive interposer

Raghunandan Chaware, K. V. Nagarajan, Kenny Ng et al. · 2012 · 14 citations

Engineering, Reliability Assessment, Computer Architecture +20