H. Huebner

3D Chip Stack Technology Using Through-Chip Interconnects

P. Benkart, A. Kaiser, A. Munding et al. · IEEE Design & Test of Computers · 2005 · 91 citations

Engineering, Computer Architecture, True Multilayer Stacks +17

Microcontacts with sub-30μm pitch for 3D chip-on-chip integration

H. Huebner, S. Penka, B. Barchmann et al. · Microelectronic Engineering · 2006 · 82 citations

3D Ic Architecture, Electrical Engineering, Engineering +9

Three-dimensional integration scheme with a thermal budget below 300 °C

P. Benkart, A. Munding, A. Kaiser et al. · Sensors and Actuators A Physical · 2007 · 22 citations

Numerical Analysis, 3D Ic Architecture, Engineering +11

Concept for diamond 3-D integrated UV sensor

A. Kaiser, Daniel Kueck, P. Benkart et al. · Diamond and Related Materials · 2006 · 17 citations

Diamond-like Carbon, Engineering, Sensor Design +2