A. Munding

3D Chip Stack Technology Using Through-Chip Interconnects

P. Benkart, A. Kaiser, A. Munding et al. · IEEE Design & Test of Computers · 2005 · 91 citations

Engineering, Computer Architecture, True Multilayer Stacks +17

Elements for surface microfluidics in diamond

Raphael Müller, P. Schmid, A. Munding et al. · Diamond and Related Materials · 2004 · 38 citations

Materials Science, Diamond-like Carbon, Engineering +6

Three-dimensional integration scheme with a thermal budget below 300 °C

P. Benkart, A. Munding, A. Kaiser et al. · Sensors and Actuators A Physical · 2007 · 22 citations

Numerical Analysis, 3D Ic Architecture, Engineering +11

Concept for diamond 3-D integrated UV sensor

A. Kaiser, Daniel Kueck, P. Benkart et al. · Diamond and Related Materials · 2006 · 17 citations

Diamond-like Carbon, Engineering, Sensor Design +2

Chip-Package-Board Reliability of System-in-Package Using Laminate Chip Embedding Technology Based on Cu Leadframe

Peter Fruehauf, A. Munding, K. Pressel et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 12 citations

Engineering, Computer Architecture, Reliability Engineering +16