A. Kaiser

3D Chip Stack Technology Using Through-Chip Interconnects

P. Benkart, A. Kaiser, A. Munding et al. · IEEE Design & Test of Computers · 2005 · 91 citations

Engineering, Computer Architecture, True Multilayer Stacks +17

Diamond MISFET based on boron delta-doped channel

H. El-Hajj, A. Denisenko, A. Kaiser et al. · Diamond and Related Materials · 2008 · 75 citations

Diamond-like Carbon, Electrical Engineering, Engineering +3

Unlocking diamond's potential as an electronic material

R.S. Balmer, I. Friel, Siobhan Woollard et al. · Philosophical Transactions of the Royal Society A Mathematical Physical and Engineering Sciences · 2007 · 50 citations

Engineering, Material Innovation, Semiconductor Device +18

H₂S sensing for breath analysis with Au functionalized ZnO nanowires

A. Kaiser, Erick Torres Ceja, Yujia Liu et al. · Nanotechnology · 2021 · 26 citations · Full text

Three-dimensional integration scheme with a thermal budget below 300 °C

P. Benkart, A. Munding, A. Kaiser et al. · Sensors and Actuators A Physical · 2007 · 22 citations

Numerical Analysis, 3D Ic Architecture, Engineering +11