Concepedia

Tung T. Nguyen

TT

4

Publications

172

Citations

4

H-Index

2010

Active since

Affiliations

Binghamton University(Current)

Tung T. Nguyen is an author at Binghamton University specializing in engineering, mechanical engineering, and mechanics of materials.

Top concepts

EngineeringMechanical EngineeringMaterial ScienceElectronic PackagingMechanics Of MaterialsMechanicsApplied PhysicsMicroelectronicsCivil EngineeringMechanics Modeling

Publications per year

2010–2016

4

Publications

4

Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation

Tung T. Nguyen, Doug C. H. Yu, S. B. Park · Journal of Electronic Materials · 2011 · 66 citations

Materials Science, Engineering, Actual Sac105 +4

Effect of glue on reliability of flip chip BGA packages under thermal cycling

Tung T. Nguyen, Donggun Lee, Jae B. Kwak et al. · Microelectronics Reliability · 2010 · 43 citations

Chip-scale Package, Engineering, Advanced Packaging (Semiconductors) +7

Experimental study of the punching shear behavior of high performance steel fiber reinforced concrete slabs considering casting directions

Thuc N. Nguyen, Tung T. Nguyen, Withit Pansuk · Engineering Structures · 2016 · 42 citations

Shear Behavior, Engineering, Mechanical Engineering +10

Characterization of elasto-plastic behavior of actual SAC solder joints for drop test modeling

Tung T. Nguyen, Seungbae Park · Microelectronics Reliability · 2011 · 21 citations

Materials Science, Elasto-plastic Behavior, Engineering +7

Rows per page

1–4 of 4