Jae B. Kwak

Transient Dynamic Simulation and Full-Field Test Validation for A Slim-PCB Of Mobile Phone under Drop / Impact

Seungbae Park, Chirag Shah, Jae B. Kwak et al. · 2007 · 71 citations

Engineering, Materials Science, Digital Imaging +16

Dynamic responses of PCB under product-level free drop impact

Da Yu, Jae B. Kwak, Seungbae Park et al. · Microelectronics Reliability · 2010 · 47 citations

Engineering, Materials Engineering, Materials Science +11

Effect of glue on reliability of flip chip BGA packages under thermal cycling

Tung T. Nguyen, Donggun Lee, Jae B. Kwak et al. · Microelectronics Reliability · 2010 · 44 citations

Engineering, Materials Engineering, Materials Science +14

Reliability and thermal fatigue life prediction of solder joints for advanced automotive microelectronics

Jiachen Gao, Jae B. Kwak · Journal of Mechanical Science and Technology · 2021 · 38 citations

Engineering, Materials Engineering, Materials Science +16

Realistic warpage evaluation of printed board assembly during reflow process

Soonwan Chung, Jae B. Kwak · Soldering and Surface Mount Technology · 2015 · 27 citations

Engineering, Materials Engineering, Materials Science +15