Concepedia

S. B. Park

SB

8

Publications

179

Citations

8

H-Index

2006

Active since

Affiliations

Binghamton University(Current)

S. B. Park is an author at Binghamton University specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringMechanical EngineeringElectronic PackagingCalibrationInstrumentationMechanics Of MaterialsEducation3D PrintingMeasurementApplied Physics

Publications per year

2006–2017

8

Publications

8

Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation

Tung T. Nguyen, Doug C. H. Yu, S. B. Park · Journal of Electronic Materials · 2011 · 66 citations

Materials Science, Engineering, Actual Sac105 +4

A Novel Speckle-Free Digital Image Correlation Method for In Situ Warpage Characterization

Yuling Niu, Shuai Shao, S. B. Park et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 27 citations

Engineering, Microscopy, Mechanical Engineering +18

In-Situ Warpage Characterization of BGA Packages with Solder Balls Attached During Reflow with 3D Digital Image Correlation (DIC)

Yuling Niu, Huayan Wang, Shuai Shao et al. · 2016 · 21 citations

Engineering, Mechanical Engineering, Computer-aided Design +17

Shorter Field Life in Power Cycling for Organic Packages

S. B. Park, Izhar Z. Ahmed · Journal of Electronic Packaging · 2006 · 19 citations

Engineering, Energy Efficiency, Energy Conversion +24

Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

S. B. Park, Chirag Shah, Jae B. Kwak et al. · Journal of Electronic Packaging · 2008 · 13 citations

Impact (Mechanics), Engineering, Measurement +18

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