Dennis Lau

Experimental Testing and Failure Prediction of PBGA Package Assemblies under 3-Point Bending Condition through Computational Stress Analysis

Dennis Lau, Y. S. Chan, S. W. Ricky Lee et al. · 2006 · 16 citations

Engineering, 3-Point Bending Test, Mechanical Engineering +19

Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)

John H. Lau, Dongkai Shangguan, Dennis Lau et al. · 2004 · 16 citations

Engineering, Mechanical Engineering, Lead-free Pcb +21

A new method to evaluate BGA pad cratering in lead-free soldering

Dongji Xie, Clavius Chin, KarHwee Ang et al. · 2008 · 15 citations

Materials Science, Pcb Bga, Pcb Materials +14

Impact Performance of Microvia and Buildup Layer Materials and Its Contribution to Drop Test Failures

Dongji Xie, Jonathan Wang, Him Yu et al. · 2007 · 14 citations

Materials Engineering, Materials Science, Pcb Materials +15