Y. S. Chan

Statistics

Publications

Citations

492

H-Index

Active since

1998

Affiliations

Hong Kong University of Science and Technology(Current)

Y. S. Chan is an author at Hong Kong University of Science and Technology specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringElectronic PackagingElectrical Engineering3D IntegrationMaterial ScienceMicroelectronicsComputer EngineeringPhysicsHydrogenCatalysis

Publications per year

1998–2023

Publications

Photonic Band Gaps in Two Dimensional Photonic Quasicrystals

Y. S. Chan, C. T. Chan, Z. Y. Liu · Physical Review Letters · 1998 · 391 citations

Photonics, Quantum Photonics, Optical Materials +13

Insights into the contribution of oxygen vacancies on CO2 activation for dry reforming of methane over ceria-based solid solutions

Yaning Wang, Y. S. Chan, Rongjun Zhang et al. · Chemical Engineering Journal · 2023 · 42 citations

Materials Science, Co2 Activation, Carbon Sequestration +12

3D IC Integration with TSV Interposers for High Performance Applications

John H. Lau, Y. S. Chan, S.W.R. Lee · Rare & Special e-Zone (The Hong Kong University of Science and Technology) · 2010 · 29 citations

3D Ic Architecture, Electrical Engineering, Engineering +9

Experimental Testing and Failure Prediction of PBGA Package Assemblies under 3-Point Bending Condition through Computational Stress Analysis

Dennis Lau, Y. S. Chan, S. W. Ricky Lee et al. · 2006 · 16 citations

Engineering, 3-Point Bending Test, Mechanical Engineering +19

Thermal-Enhanced and Cost-Effective 3D IC Integration With TSV (Through-Silicon Via) Interposers for High-Performance Applications

John H. Lau, Y. S. Chan, S. W. Ricky Lee · 2010 · 14 citations

Engineering, Device Integration, Integrated Circuits +22

1–5 of 5