Statistics
Publications
1
Citations
15
H-Index
1
Active since
2008
Affiliations
Flex (United States)(Current)
KarHwee Ang is an author at Flex (United States) specializing in electronic packaging, mechanical engineering, and engineering.
Publications per year
2008–2008
1
1
A new method to evaluate BGA pad cratering in lead-free soldering
Dongji Xie, Clavius Chin, KarHwee Ang et al. · 2008 · 15 citations
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