Teh-Hua Ju

Thermosonic flip-chip bonding using longitudinal ultrasonic vibration

Qing Tan, Wenge Zhang, Braydon Schaible et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1998 · 56 citations

Engineering, Materials Science, Microelectromechanical Systems +13

Thermosonic bonding of an optical transceiver based on an 8×8 vertical cavity surface emitting laser array

T. McLaren, Sa Yoon Kang, Wenge Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 48 citations

Engineering, Electrical Engineering, Materials Science +17

Effects of Ceramic Ball-Grid-Array Package’s Manufacturing Variations on Solder Joint Reliability

Teh-Hua Ju, Y. C. Lee, Jay Liu · Journal of Electronic Packaging · 1994 · 23 citations

Engineering, Materials Engineering, Materials Science +14

Thermosonic bonding: an alternative to area-array solder connections

Sayoon Kang, Teh-Hua Ju, Y.C. Lee · 2002 · 11 citations

Engineering, Materials Science, Electronic Materials +13

Thermosonic flip-chip bonding for an 8×8 VCSEL array

T. McLaren, Sa Yoon Kang, Wenge Zhang et al. · 2002 · 10 citations

Engineering, Materials Science, Electronic Materials +14