Statistics
Publications
4
Citations
50
H-Index
4
Active since
1995
Affiliations
University of Colorado Boulder(Current)
Y.C. Lee is an author at University of Colorado Boulder specializing in engineering, materials science, and electronic materials.
Publications per year
1995–2002
4
4
Solder joint reliability modeling for a 540-I/O plastic ball-grid-array assembly
Buli Su, Saeed Hareb, Y.C. Lee et al. · 2002 · 13 citations
Thermosonic flip-chip bonding for an 8×8 VCSEL array
T. McLaren, Sa Yoon Kang, Wenge Zhang et al. · 2002 · 10 citations
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