Concepedia

Sivasubramanian Thirugnanasambandam

ST

4

Publications

154

Citations

4

H-Index

2012

Active since

Affiliations

Auburn University(Current)

Sivasubramanian Thirugnanasambandam is an author at Auburn University specializing in electronic packaging, engineering, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingHeat TransferMicrostructureThermal EngineeringMechanical EngineeringHigh Temperature MaterialsCorrosionThermodynamics

Publications per year

2012–2016

4

Publications

4

Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages

Jiawei Zhang, Zhou Hai, Sivasubramanian Thirugnanasambandam et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 97 citations

Engineering, Packaging Reliability, Mechanical Engineering +20

Impact of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages With Different Sn-Ag-Cu Solder Joints

Jiawei Zhang, Sivasubramanian Thirugnanasambandam, John L. Evans et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 32 citations

Engineering, Packaging Reliability, Isothermal Aging +17

Drop impact reliability testing of isothermally aged doped low creep lead-free solder paste alloys

Sharath Sridhar, Anto Raj, Seth Gordon et al. · 2016 · 14 citations

Engineering, Mechanical Engineering, Flip Chip Packages +17

Proportional Hazard Model of doped low creep lead free solder paste under thermal shock

Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas Sanders et al. · 2016 · 11 citations

Engineering, Mechanical Engineering, Thermal Shock +16

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