Concepedia

Seth Gordon

SG

2

Publications

25

Citations

2

H-Index

2016

Active since

Affiliations

Auburn University(Current)

Seth Gordon is an author at Auburn University specializing in mechanical engineering, electronic packaging, and mechanics of materials.

Top concepts

CorrosionEngineeringMicrostructureMaterial ScienceElectronic PackagingMechanical EngineeringMechanics Of MaterialsHeat TransferThermodynamicsSolid Mechanics

Publications per year

2016–2016

2

Publications

2

Drop impact reliability testing of isothermally aged doped low creep lead-free solder paste alloys

Sharath Sridhar, Anto Raj, Seth Gordon et al. · 2016 · 14 citations

Engineering, Mechanical Engineering, Flip Chip Packages +17

Proportional Hazard Model of doped low creep lead free solder paste under thermal shock

Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas Sanders et al. · 2016 · 11 citations

Engineering, Mechanical Engineering, Thermal Shock +16

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