Concepedia

Anto Raj

AR

4

Publications

53

Citations

4

H-Index

2016

Active since

Affiliations

Auburn University(Current)

Tennessee Technological University

Anto Raj is an author at Auburn University specializing in materials science, electronic packaging, and engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingCorrosionMicrostructureHeat TransferThermodynamicsFailure AnalysisThermal EngineeringElectrical Engineering

Publications per year

2016–2020

4

Publications

4

Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation

Anto Raj, Thomas Sanders, Sharath Sridhar et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 17 citations

Engineering, Sac305 Solder, Advanced Packaging (Semiconductors) +18

Drop impact reliability testing of isothermally aged doped low creep lead-free solder paste alloys

Sharath Sridhar, Anto Raj, Seth Gordon et al. · 2016 · 14 citations

Engineering, Mechanical Engineering, Flip Chip Packages +17

Proportional Hazard Model of doped low creep lead free solder paste under thermal shock

Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas Sanders et al. · 2016 · 11 citations

Engineering, Mechanical Engineering, Thermal Shock +16

Assembly Options and Challenges for Electronic Products With Lead-Free Exemption

Chien‐Ming Huang, Anto Raj, Michael Osterman et al. · IEEE Access · 2020 · 11 citations · Full text

Pb-based Solder, Engineering, Industrial Engineering +16

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