3
Publications
42
Citations
3
H-Index
2016
Active since
Affiliations
Sharath Sridhar is an author at Auburn University specializing in electronic packaging, materials science, and microstructure.
Top concepts
CorrosionEngineeringMicrostructureMaterial ScienceElectronic PackagingHeat TransferThermodynamicsFailure AnalysisThermal EngineeringMechanical Engineering
Publications per year
2016–2019
3
3
Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation
Anto Raj, Thomas Sanders, Sharath Sridhar et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 17 citations
Engineering, Sac305 Solder, Advanced Packaging (Semiconductors) +18
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