Zhou Hai

Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages

Jiawei Zhang, Zhou Hai, Sivasubramanian Thirugnanasambandam et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 97 citations

Engineering, Packaging Reliability, Mechanical Engineering +20

Thermal cycling reliability of aged PBGA assemblies - comparison of Weibull failure data and finite element model predictions

Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling et al. · 2015 · 56 citations

Engineering, Mechanical Engineering, Failure Behavior +19

Reliability Comparison of Aged SAC Fine-Pitch Ball Grid Array Packages Versus Surface Finishes

Zhou Hai, Jiawei Zhang, Chaobo Shen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015 · 50 citations

Advanced Packaging, Materials Science, Electrical Engineering +12

Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling

Chaobo Shen, Zhou Hai, Cong Zhao et al. · Materials · 2017 · 32 citations · Full text

Reliability Analysis of Lead-Free Solder Joints with Solder Doping on Harsh Environment

Cong Zhao, Thomas Sanders, Zhou Hai et al. · IMAPSource Proceedings · 2016 · 10 citations

Materials Science, Advanced Packaging, Electrical Engineering +11