Concepedia

Cong Zhao

CZ

6

Publications

128

Citations

6

H-Index

2015

Active since

Affiliations

Auburn University(Current)

Cong Zhao is an author at Auburn University specializing in electrical engineering, electronic packaging, and materials science.

Top concepts

CorrosionEngineeringMaterial ScienceElectronic PackagingElectrical EngineeringHeat TransferMicrostructureMicroelectronicsThermal EngineeringMechanical Engineering

Publications per year

2015–2018

6

Publications

6

Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling

Chaobo Shen, Zhou Hai, Cong Zhao et al. · Materials · 2017 · 32 citations · Full text

Effect of Surface Finish and High Bi Solder Alloy on Component Reliability in Thermal Cycling

Sa’d Hamasha, Francy John Akkara, Mohammed Abueed et al. · 2018 · 28 citations

Engineering, Mechanical Engineering, Advanced Packaging (Semiconductors) +21

All-Quartz High Accuracy MEMS Pressure Sensor Based on Double-Ended Tuning Fork Resonator

J. Wang, Cong Zhao, G.H. Zhao et al. · Procedia Engineering · 2015 · 23 citations · Full text

Effect of Solder Sphere Alloys and Surface Finishes on the Reliability of Lead-Free Solder Joints in Accelerated Thermal Cycling

Francy John Akkara, Cong Zhao, Raed Athamenh et al. · 2018 · 22 citations

Engineering, Mechanical Engineering, Cold Working +19

Board Level Reliability of Lead-Free Solder Interconnections with Solder Doping Under Harsh Environment

Cong Zhao · 2017 · 13 citations

Materials Science, Electrical Engineering, Engineering +10

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