Kaushik Kumar

Tantalum Nitride Films Grown by Inorganic Low Temperature Thermal Chemical Vapor Deposition Diffusion Barrier Properties in Copper Metallization

Alain E. Kaloyeros, Xiaomeng Chen, T. Stark et al. · Journal of The Electrochemical Society · 1999 · 75 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Challenges and mitigation strategies for resist trim etch in resist-mandrel based SAQP integration scheme

Nihar Mohanty, Elliott Franke, Eric Liu et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2015 · 17 citations

Engineering, Electrical Engineering, Materials Engineering +16

Manufacturability considerations for DSA

Richard A. Farrell, Erik R. Hosler, Gerard M. Schmid et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2014 · 14 citations

Engineering, Materials Engineering, Materials Science +16

Co-optimization of lithographic and patterning processes for improved EPE performance

Mark J. Maslow, Vadim Timoshkov, Ton Kiers et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2017 · 10 citations

Engineering, Materials Science, Digital Fabrication +10