M.K. Iyer

Modeling of simultaneous switching noise in high speed systems

Sungjun Chun, Madhavan Swaminathan, L.D. Smith et al. · IEEE Transactions on Advanced Packaging · 2001 · 115 citations

Engineering, Computer Engineering, Electrical Engineering +17

Three-dimensional system-in-package using stacked silicon platform technology

V. Kripesh, Seung Wook Yoon, V.P. Ganesh et al. · IEEE Transactions on Advanced Packaging · 2005 · 76 citations

Engineering, Computer Engineering, Electronic Materials +16

Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards

Jingook Kim, Mihai Rotaru, Seungyong Baek et al. · IEEE Transactions on Electromagnetic Compatibility · 2006 · 58 citations

Engineering, Electrical Engineering, Circuit Theory +13

Engineering interfacial polarization switching in van der Waals multilayers

Madeline Van Winkle, Nikita Dowlatshahi, Nikta Khaloo et al. · Nature Nanotechnology · 2024 · 56 citations

Natural Sciences, Materials Engineering, Materials Science +14

Fluid flow and heat transfer in liquid cooled foam heat sinks for electronic packages

Hengyun Zhang, D. Pinjala, Yogendra Joshi et al. · IEEE Transactions on Components and Packaging Technologies · 2005 · 55 citations

Engineering, Materials Engineering, Materials Science +17