Kenneth Wu

Electrical conduction and TDDB reliability characterization for low-k SiCO dielectric in Cu interconnects

Robin C.J. Wang, Kuei‐Shu Chang‐Liao, T.K. Wang et al. · Thin Solid Films · 2008 · 25 citations

Natural Sciences, Electrical Engineering, Materials Science +17

A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect

Robin C.J. Wang, Chang‐Chun Lee, L.D. Chen et al. · Microelectronics Reliability · 2006 · 24 citations

Natural Sciences, Materials Engineering, Materials Science +12

Convergence of Hot-Carrier-Induced Saturation Region Drain Current and On-Resistance Degradation in Drain Extended MOS Transistors

Jone F. Chen, Shiang-Yu Chen, Kuo-Ming Wu et al. · IEEE Transactions on Electron Devices · 2009 · 21 citations

Engineering, Electrical Engineering, Microelectronics +16

Supporting feedback and assessment of digital ink answers to in-class exercises

Kimberle Koile, Kevin Chevalier, Michel A Rbeiz et al. · 2007 · 19 citations

Education, Computer Science, Educational Technology +17

A CDM-like damage mechanism for multiple power domains fabricated with Deep N-well processes

Yu-Lin Chu, Hsi-Yu Kuo, Jinn-Wen Young et al. · 2017 · 18 citations

Engineering, Computer Engineering, Electrical Engineering +17