Renshi Sawada

Low-Temperature Bonding of Laser Diode Chips on Silicon Substrates Using Plasma Activation of Au Films

Eiji Higurashi, Teppei Imamura, Tadatomo Suga et al. · IEEE Photonics Technology Letters · 2007 · 130 citations

Natural Sciences, Electrical Engineering, Materials Science +16

Room-Temperature Bonding of Vertical-Cavity Surface-Emitting Laser Chips on Si Substrates Using Au Microbumps in Ambient Air

Ryo Takigawa, Eiji Higurashi, Tadatomo Suga et al. · Applied Physics Express · 2008 · 98 citations

Engineering, Electrical Engineering, Materials Science +14

A Piezoelectric Micromachined Ultrasonic Transducer Using Piston-Like Membrane Motion

Tao Wang, Renshi Sawada, Chengkuo Lee · IEEE Electron Device Letters · 2015 · 79 citations

Medicine, Biomedical Engineering, Acoustics +15

Reactive–fast-atom beam etching of GaAs using Cl2 gas

Fusao Shimokawa, Hidenao Tanaka, Yuji Uenishi et al. · Journal of Applied Physics · 1989 · 62 citations

Engineering, Materials Engineering, Materials Science +13

Integrated micro-displacement sensor that measures tilting angle and linear movement of an external mirror

Itaru Ishikawa, Renshi Sawada, Eiji Higurashi et al. · Sensors and Actuators A Physical · 2007 · 52 citations

Engineering, Mechanical Engineering, Mechatronics Engineering +16