Statistics
Publications
6
Citations
294
H-Index
6
Active since
2003
Cheng Chen is an author at Chinese Academy of Sciences specializing in engineering, electronic packaging, and thermodynamics.
Publications per year
2003–2019
6
6
Cheng Chen, Daquan Yu, Teng Wang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 43 citations
Fan-out Packages, Electrical Engineering, Chip-scale Package +14
Rows per page
1–5 of 6