Kimihiro Yamanaka - Concepedia

Author

Kimihiro Yamanaka

Kyocera (Japan)

Also Known As

Kimihiro YAMANAKA, Kimihiro Yamanaka, Yamanaka, Kimihiro

102

Publications

485

Citations

H-Index

Concepts

All Affiliations

Kyocera (Japan)The University of Osaka Tokyo Metropolitan University Osaka Research Institute of Industrial Science and Technology Kyocera (United States)

About

Kimihiro Yamanaka is an author at Kyocera (Japan) specializing in engineering, materials science, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	10	11	277
2	Education	1	1	44
3	Health Sciences	1	1	10
4	Medicine	1	1	10
5	Social Sciences	1	1	44

Kimihiro Yamanaka

Publications

351

Citations

H-Index

Page 1

	Year	Citations
Studies on solder bump electromigration in Cu/Sn–3Ag–0.5Cu/Cu system Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma Microelectronics Reliability Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineering	2006	54
Convenient Evaluation of Mental Stress With Pupil Diameter Kimihiro Yamanaka, Mitsuyuki Kawakami International Journal of Occupational Safety and Ergonomics NeuropsychologyEducationHuman Performance ModelingPsychologySocial Sciences	2009	44
Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints Kiju Lee, Keun‐Soo Kim, Yutaka Tsukada, Journal of materials research/Pratt's guide to venture capital sources Materials EngineeringMaterials ScienceElectromigration TechniqueEngineeringApplied Physics	2011	41
Influence of crystallographic orientation of Sn–Ag–Cu on electromigration in flip-chip joint Kiju Lee, Keun‐Soo Kim, Yutaka Tsukada, Microelectronics Reliability Materials EngineeringMaterials ScienceElectromigration TechniqueEngineeringNanotechnology	2011	38
Electromigration effect on solder bump in Cu/Sn–3Ag–0.5Cu/Cu system Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma Scripta Materialia Materials EngineeringMaterials ScienceElectrical EngineeringElectromigration TechniqueEngineering	2006	32
Electromigration behavior in Cu/Ni–P/Sn–Cu based joint system with low current density Takuya Kadoguchi, Keisuke Gotou, Kimihiro Yamanaka, Microelectronics Reliability Materials ScienceLow Current DensityElectrical EngineeringElectromigration TechniqueEngineering	2015	21
Effect of underfill on electromigration lifetime in flip chip joints Kimihiro Yamanaka, Takafumi Ooyoshi, Takayuki Nejime Journal of Alloys and Compounds Materials EngineeringElectrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)	2009	20
Solder electromigration in Cu/In/Cu flip chip joint system Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma Journal of Alloys and Compounds Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringChip On Board	2006	17
Materials, Processes, and Performance of High-Wiring Density Buildup Substrate With Ultralow-Coefficient of Thermal Expansion Kimihiro Yamanaka, Kaoru KOBAYASHI, Katsura Hayashi, IEEE Transactions on Components and Packaging Technologies EngineeringAdvanced Buildup SubstrateIntegrated CircuitsInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2009	17
Advanced Surface Laminar Circuit Packaging with low Coefficient of Thermal Expansion and high wiring density Kimihiro Yamanaka, Kaoru KOBAYASHI, Katsura Hayashi, EngineeringIntegrated CircuitsLow CoefficientInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2009	17

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