Concepedia

Kimihiro Yamanaka

KY

15

Publications

351

Citations

10

H-Index

1993

Active since

Affiliations

Kyocera (Japan)(Current)

The University of Osaka

Tokyo Metropolitan University

Osaka Research Institute of Industrial Science and Technology

Kyocera (United States)

Kimihiro Yamanaka is an author at Kyocera (Japan) specializing in engineering, materials science, and microelectronics.

Top concepts

EngineeringMaterial ScienceMicroelectronicsElectronic PackagingElectrical EngineeringApplied PhysicsMaterials EngineeringMicrofabricationBiometricsEye Tracking

Publications per year

1993–2015

15

Publications

15

Studies on solder bump electromigration in Cu/Sn–3Ag–0.5Cu/Cu system

Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma · Microelectronics Reliability · 2006 · 54 citations

Materials Science, Materials Engineering, Electrical Engineering +6

Convenient Evaluation of Mental Stress With Pupil Diameter

Kimihiro Yamanaka, Mitsuyuki Kawakami · International Journal of Occupational Safety and Ergonomics · 2009 · 44 citations

Neuropsychology, Education, Human Performance Modeling +18

Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints

Kiju Lee, Keun‐Soo Kim, Yutaka Tsukada et al. · Journal of materials research/Pratt's guide to venture capital sources · 2011 · 41 citations

Materials Engineering, Materials Science, Electromigration Technique +5

Influence of crystallographic orientation of Sn–Ag–Cu on electromigration in flip-chip joint

Kiju Lee, Keun‐Soo Kim, Yutaka Tsukada et al. · Microelectronics Reliability · 2011 · 38 citations

Materials Engineering, Materials Science, Electromigration Technique +7

Electromigration effect on solder bump in Cu/Sn–3Ag–0.5Cu/Cu system

Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma · Scripta Materialia · 2006 · 32 citations

Materials Engineering, Materials Science, Electrical Engineering +6

Rows per page

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