Publication | Closed Access
Studies on solder bump electromigration in Cu/Sn–3Ag–0.5Cu/Cu system
54
Citations
31
References
2006
Year
Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineeringInterconnect (Integrated Circuits)Electronic PackagingMicroelectronicsSolder Bump Electromigration
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