Publication | Closed Access
Influence of crystallographic orientation of Sn–Ag–Cu on electromigration in flip-chip joint
38
Citations
34
References
2011
Year
Materials EngineeringMaterials ScienceElectromigration TechniqueEngineeringNanotechnologyApplied PhysicsCrystallographic OrientationElectronic PackagingFlip-chip JointElectrochemical Surface Science
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