Minoru Ueshima

Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints

Kiju Lee, Keun‐Soo Kim, Yutaka Tsukada et al. · Journal of materials research/Pratt's guide to venture capital sources · 2011 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +11

Thermal and mechanical stability of soldering QFP with Sn-Bi-Ag lead-free alloy

Katsuaki Suganuma, Tetsuo Sakai, Keun‐Soo Kim et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 40 citations

Natural Sciences, Materials Engineering, Materials Science +17

Influence of crystallographic orientation of Sn–Ag–Cu on electromigration in flip-chip joint

Kiju Lee, Keun‐Soo Kim, Yutaka Tsukada et al. · Microelectronics Reliability · 2011 · 38 citations

Natural Sciences, Materials Engineering, Materials Science +11

Self-catalyzed copper–silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper–silver hybrid tracks at a low temperature below 100 °C

Wanli Li, Cai‐Fu Li, Fengpei Lang et al. · Nanoscale · 2018 · 24 citations

Natural Sciences, Materials Engineering, Materials Science +17

Effects of reflow atmosphere and flux on Sn whisker growth of Sn–Ag–Cu solders

Alongheng Baated, Keun‐Soo Kim, Katsuaki Suganuma et al. · Journal of Materials Science Materials in Electronics · 2010 · 22 citations

Natural Sciences, Materials Engineering, Materials Science +11