Publication | Closed Access
Electromigration effect on solder bump in Cu/Sn–3Ag–0.5Cu/Cu system
32
Citations
4
References
2006
Year
Materials EngineeringMaterials ScienceElectrical EngineeringElectromigration TechniqueEngineeringSolder BumpElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)
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