Shiguo Liu

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Xiaowu Zhang, T.C. Chai, John H. Lau et al. · 2009 · 109 citations

Engineering, Computer Engineering, Electrical Engineering +17

Mutations in ASH1L confer susceptibility to Tourette syndrome

Shiguo Liu, Miaomiao Tian, Fan He et al. · Molecular Psychiatry · 2019 · 74 citations

Life Sciences, Genetics, Molecular Genetics +10

Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Xiaowu Zhang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 55 citations

Engineering, Electrical Engineering, Electronic Materials +16

Evaluation of Glutathione Peroxidase 4 role in Preeclampsia

Xinguo Peng, Yan Lin, Jinling Li et al. · Scientific Reports · 2016 · 35 citations · Full text

Medicine, Genetics, Obstetrics +12

Role of IL-17 Variants in Preeclampsia in Chinese Han Women

Haiyan Wang, Mingzhen Guo, Fenghua Liu et al. · PLoS ONE · 2015 · 28 citations · Full text

Life Sciences, Genetics, Immunology +17