Shiguo Liu

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Xiaowu Zhang, T.C. Chai, John H. Lau et al. · 2009 · 109 citations

Engineering, Computer Architecture, Large Die +17

Mutations in ASH1L confer susceptibility to Tourette syndrome

Shiguo Liu, Miaomiao Tian, Fan He et al. · Molecular Psychiatry · 2019 · 71 citations

Genetic Disorder, Genetics, Stereotypic Movement Disorder +2

Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Xiaowu Zhang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 52 citations

Engineering, Integrated Circuits, Continuous Push +16

Evaluation of Glutathione Peroxidase 4 role in Preeclampsia

Xinguo Peng, Yan Lin, Jinling Li et al. · Scientific Reports · 2016 · 34 citations · Full text

Role of IL-17 Variants in Preeclampsia in Chinese Han Women

Haiyan Wang, Mingzhen Guo, Fenghua Liu et al. · PLoS ONE · 2015 · 28 citations · Full text