Sodai Ebiko is an author at Yokohama National University.
Publications per year
2023–2024
3
3
Exploring Bonding Mechanism of SiCN for Hybrid Bonding
Sodai Ebiko, Serena Iacovo, Soon-Aik Chew et al. · 2024 · 18 citations
Robust Measurement of Bonding Strength for Wafer-to-Wafer 3D Integration
Junya Fuse, Tomoya Iwata, Sodai Ebiko et al. · 2023 · 10 citations
Low Temperature Wafer Level Hybrid Bonding Enabled by Advanced SiCN and Surface Activation
Fumihiro Inoue, Atsushi Nagata, Junya Fuse et al. · 2024 · 10 citations
Rows per page
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