Concepedia

Junya Fuse

JF

Statistics

Publications

4

Citations

62

H-Index

4

Active since

2023

Affiliations

Yokohama National University(Current)

Junya Fuse is an author at Yokohama National University specializing in corrosion engineering, interface science, and corrosion evaluation.

Publications per year

2023–2024

4

Publications

4

Water stress corrosion at wafer bonding interface during bond strength evaluation

Tomoya Iwata, Junya Fuse, Yuki Yoshihara et al. · Materials Science in Semiconductor Processing · 2024 · 23 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Low Temperature Wafer Level Hybrid Bonding Enabled by Advanced SiCN and Surface Activation

Fumihiro Inoue, Atsushi Nagata, Junya Fuse et al. · 2024 · 15 citations

Natural Sciences, Materials Engineering, Materials Science +15

Robust Measurement of Bonding Strength for Wafer-to-Wafer 3D Integration

Junya Fuse, Tomoya Iwata, Sodai Ebiko et al. · 2023 · 13 citations

Engineering, Materials Engineering, Materials Science +14

Bond Strength Measurement for Wafer-Level and Chip-Level Hybrid Bonding

Junya Fuse, Yuki Yoshihara, Marie Sano et al. · 2024 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +15

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