Tomoya Iwata is an author at Yokohama National University specializing in materials engineering, electronic packaging, and microelectronics.
Top concepts
ChemistryEngineeringApplied PhysicsSurface ScienceMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingMaterials EngineeringElectrical Engineering
Publications per year
2023–2024
3
3
Inorganic Temporary Direct Bonding for Collective Die to Wafer Hybrid Bonding
Fumihiro Inoue, Shunsuke Teranishi, Tomoya Iwata et al. · 2023 · 24 citations
Robust Measurement of Bonding Strength for Wafer-to-Wafer 3D Integration
Junya Fuse, Tomoya Iwata, Sodai Ebiko et al. · 2023 · 10 citations
Rows per page
1–3 of 3