Soon-Aik Chew

The Challenges and Solutions of Cu/SiCN Wafer-to-Wafer Hybrid Bonding Scaling Down to 400nm Pitch

Soon-Aik Chew, Boyao Zhang, Kris Vanstreels et al. · 2023 · 26 citations

Process Variation Analysis of Device Performance Using Virtual Fabrication: Methodology Demonstrated on a CMOS 14-nm FinFET Vehicle

Benjamin Vincent, Raghu Hathwar, M. Kamon et al. · IEEE Transactions on Electron Devices · 2020 · 20 citations

Device Modeling, Finfet Device, Electrical Engineering +15

Exploring Bonding Mechanism of SiCN for Hybrid Bonding

Sodai Ebiko, Serena Iacovo, Soon-Aik Chew et al. · 2024 · 18 citations

Diffusion and Gate Replacement: A New Gate-First High-<inline-formula> <tex-math notation="LaTeX">$k$ </tex-math></inline-formula>/Metal Gate CMOS Integration Scheme Suppressing Gate Height Asymmetry

R. Ritzenthaler, T. Schram, A. Spessot et al. · IEEE Transactions on Electron Devices · 2015 · 16 citations

Engineering, Vlsi Design, Emerging Memory Technology +16

700nm pitch Cu/SiCN wafer-to-wafer hybrid bonding

Soon-Aik Chew, Serena Iacovo, Ferenc Fordor et al. · 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) · 2022 · 16 citations

Materials Engineering, Materials Science, Artificial Intelligence +12