Qing-Tang Jiang

Analysis of copper grains in damascene trenches after rapid thermal processing or furnace anneals

Qing-Tang Jiang, Matt Nowell, Brendan Foran et al. · Journal of Electronic Materials · 2002 · 24 citations

Materials Science, Engineering, Damascene Trenches +6

Recrystallization effects in Cu electrodeposits used in fine line damascene structures

Qing-Tang Jiang, Michael E. Thomas · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2001 · 23 citations

Engineering, Electrode-electrolyte Interface, Thin Film Process Technology +22

Line width dependence of copper resistivity

Qing-Tang Jiang, Ming‐Hsing Tsai, Robert Havemann · 2001 · 23 citations

Engineering, Line Width Dependence, Electron Diffraction +17

Mechanism of electromigration failure in submicron Cu interconnects

Nancy L. Michael, Choong-Un Kim, Qing-Tang Jiang et al. · Journal of Electronic Materials · 2002 · 22 citations

Electrical Engineering, Electromigration Technique, Engineering +7

Copper electroplating for advanced interconnect technology

Robert Mikkola, Qing-Tang Jiang, Brad Carpenter · Plating and surface finishing · 2000 · 17 citations

Engineering, Chemical Deposition, Gap Fill +18