R. Eisele

Novel bonding and joining technology for power electronics - Enabler for improved lifetime, reliability, cost and power density

Siegbert Haumann, Jacek Rudzki, Frank Osterwald et al. · 2013 · 29 citations

Materials Science, Electrical Engineering, Engineering +14

Strength and reliability of low temperature transient liquid phase bonded Cu Sn Cu interconnects

Mads Brincker, S. Söhl, R. Eisele et al. · Microelectronics Reliability · 2017 · 27 citations

Materials Science, Materials Engineering, Engineering +5

Power Modules with Increased Power Density and Reliability Using Cu Wire Bonds on Sintered Metal Buffer Layers

Jacek Rudzki, Martin Becker, R. Eisele et al. · Fraunhofer-Publica (Fraunhofer-Gesellschaft) · 2014 · 27 citations

Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density

Bianca Boettge, Falk Naumann, Stefan Behrendt et al. · 2018 · 16 citations

Engineering, Cement Manufacture, Mechanical Engineering +20

"LaTIMA" an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials

Mohamad Abo Ras, D. May, R. Schacht et al. · 2015 · 15 citations

Pulse Delta Technique, Engineering, Innovative Test Stand +22