Concepedia

Stefan Behrendt

SB

2

Publications

39

Citations

2

H-Index

2018

Active since

Affiliations

University of Tübingen(Current)

Fraunhofer Institute for Microstructure of Materials and Systems

Robert Bosch (Germany)

Heraeus (Germany)

Stefan Behrendt is an author at University of Tübingen specializing in high temperature materials, electronic packaging, and engineering.

Top concepts

EngineeringMaterial ScienceMicroelectronicsElectronic PackagingElectrical EngineeringHigh Temperature MaterialsHeat TransferEnergy StorageApplied PhysicsPower Electronics

Publications per year

2018–2018

2

Publications

2

Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging

Stefan Kaessner, Markus G. Scheibel, Stefan Behrendt et al. · Journal of Microelectronics and Electronic Packaging · 2018 · 23 citations

Engineering, Chip Surface, Polymeric Encapsulation Materials +18

Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density

Bianca Boettge, Falk Naumann, Stefan Behrendt et al. · 2018 · 16 citations

Engineering, Cement Manufacture, Mechanical Engineering +20

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