Concepedia

Jacek Rudzki

JR

6

Publications

178

Citations

6

H-Index

2004

Active since

Affiliations

Technische Universität Braunschweig(Current)

Fachhochschule Kiel

Silicon Power Corporation (United States)

Otto-von-Guericke University Magdeburg

Chemnitz University of Technology

Jacek Rudzki is an author at Technische Universität Braunschweig specializing in electrical engineering, engineering, and electronic packaging.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringHeat TransferPower ElectronicsThermal EngineeringThermodynamicsMaterial ScienceEnergy Efficiency

Publications per year

2004–2020

6

Publications

6

Double-sided low-temperature joining technique for power cycling capability at high temperature

Raed Amro, Josef Lutz, Jacek Rudzki et al. · 2005 · 57 citations

Engineering, Energy Efficiency, Power Devices +20

Power Cycling at High Temperature Swings of Modules with Low Temperature Joining Technique

Raed Amro, Josef Lutz, Jacek Rudzki et al. · 2006 · 39 citations

Engineering, Energy Efficiency, Standard Packaging +21

Novel bonding and joining technology for power electronics - Enabler for improved lifetime, reliability, cost and power density

Siegbert Haumann, Jacek Rudzki, Frank Osterwald et al. · 2013 · 29 citations

Materials Science, Electrical Engineering, Engineering +14

Power Modules with Increased Power Density and Reliability Using Cu Wire Bonds on Sintered Metal Buffer Layers

Jacek Rudzki, Martin Becker, R. Eisele et al. · Fraunhofer-Publica (Fraunhofer-Gesellschaft) · 2014 · 27 citations

Top-side chip contacts with low temperature joining technique (LTJT)

Christian Mertens, Jacek Rudzki, R. Sittig · 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551) · 2004 · 13 citations

Materials Science, Electrical Engineering, Top-side Chip Contacts +15

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