Concepedia

Frank Osterwald

FO

3

Publications

69

Citations

3

H-Index

2013

Active since

Affiliations

Silicon Power Corporation (United States)(Current)

Danfoss (Germany)

Frank Osterwald is an author at Silicon Power Corporation (United States) specializing in power electronics, electronic packaging, and engineering.

Top concepts

Publications per year

2013–2020

3

Publications

3

Novel bonding and joining technology for power electronics - Enabler for improved lifetime, reliability, cost and power density

Siegbert Haumann, Jacek Rudzki, Frank Osterwald et al. · 2013 · 29 citations

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Power Modules with Increased Power Density and Reliability Using Cu Wire Bonds on Sintered Metal Buffer Layers

Jacek Rudzki, Martin Becker, R. Eisele et al. · Fraunhofer-Publica (Fraunhofer-Gesellschaft) · 2014 · 27 citations

Thermomechanical Deformations of Power Modules with Sintered Metal Buffer Layers under Consideration of the Operating Time and Conditions

Alexander Schiffmacher, Juergen Wilde, Carsten Kempiak et al. · 2020 · 13 citations

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