T. Diep

A comparison of electrostatic discharge models and failure signatures for CMOS integrated circuit devices

Mary Alexandria Kelly, G. Servais, T. Diep et al. · 1995 · 40 citations

Circuit Devices, Engineering, Electromagnetic Compatibility +17

The importance of standardizing CDM ESD test head parameters to obtain data correlation

L. Henry, Mary Alexandria Kelly, T. Diep et al. · 2002 · 18 citations

Electrical Engineering, Engineering, Pogo Pin Diameter +13

Charged device model (CDM) metrology: limitations and problems

L. Henry, H. Hyatt, Jon Barth et al. · 2005 · 12 citations

Device Modeling, Electrical Engineering, Engineering +15

Issues concerning CDM ESD verification modules-the need to move to alumina

L. Henry, Mary Alexandria Kelly, T. Diep et al. · 2003 · 12 citations

Cdm Esd Verification, Electrical Engineering, Waveform Verification Modules +10

Integration of TLP analysis for ESD troubleshooting

Li-Moum Ting, C. Duvvury, O. Trevino et al. · Electrical Overstress/Electrostatic Discharge Symposium · 2001 · 10 citations

Hardware Security, Reliability Engineering, Engineering +12