C.J. Berry

Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking

Riet Labie, Paresh Limaye, C.J. Berry et al. · 2010 · 60 citations

Engineering, Cu-sn Imc Bumps, Integrated Circuits +16

Application of through mold via (TMV) as PoP base package

Jinseong Kim, Kiwook Lee, Dongjoo Park et al. · 2008 · 53 citations

Mold Control, 3D Ic Architecture, Chip-scale Package +13

Effect of joint size and pad metallization on solder mechanical properties

Robert Darveaux, Corey Reichman, C.J. Berry et al. · 2008 · 20 citations

Friction Welding, Engineering, Mechanical Engineering +20

Flip Chip Technology: A Method for Providing Known Good Die with High Density Interconnections

G.M. Adema, C.J. Berry, Nicholas G. Koopman et al. · 2005 · 13 citations

Flip Chip Technology, Engineering, Highest Interconnection Density +16